Industry’s Smallest High-End Mics to Be Shown at InfoComm 2019

ORLANDO, MAY 1, 2019 – DPA Microphones will introduce the U.S. conference, AV and installation markets to the industry’s smallest-ever high-end pro audio microphone capsule at InfoComm 2019 (Booth 6861). Incorporated into the d:screet™ CORE 6060 and 6061 Subminiature Microphones and d:fine™ CORE 6066 Subminiature Headset Microphone, DPA’s new subminiature microphone capsules measure in at […]