Rio Rancho, NM (April 16, 2026) — Lectrosonics is proud to announce the launch of the L1 Sub-Miniature Lavalier Microphone, marking a new era in high-fidelity audio capture. Born from a landmark collaboration within the Freedman Group and featuring the breakthrough Sonaura™ capsule technology, the L1 sets a new industry benchmark for performance, consistency, and environmental resilience.
At the heart of the L1 lies the Sonaura™ capsule, the result of a five-year, $10M research investment. Manufactured by semiconductor leader Infineon, this studio-grade MEMS (Micro-Electro-Mechanical Systems) silicon technology replaces traditional FET-based designs with a patented encapsulated diaphragm.
Unlike traditional capsules that can vary significantly between batches, the L1’s silicon fabrication ensures unprecedented precision. Every L1 unit is matched in both sensitivity and frequency response to within 0.5dB, offering production mixers and sound designers absolute repeatability across multiple talent microphones.
The L1 delivers the holy grail of specifications, ideal for film, television, and theater professionals, including:
- Ultra-Low Noise Floor: With an EIN of just 11dB(A), the L1 outperforms every other professional sub-miniature lavalier currently on the market.
- Massive Dynamic Range: Offering an 83 dB signal-to-noise ratio for crystal-clear voice and instrument capture.
- High SPL Handling: When paired with the Lectrosonics DSSM transmitter, the L1 features a world-first switchable sensitivity mode, allowing it to handle up to 135dBA SPL—ideal for the rigors of opera and Broadway musicals.
- Flat Frequency Response: Designed for a natural, uncolored sound that can be tailored via interchangeable acoustic caps (included) for either flat or elevated high-frequency response.
Designed for the harshest production environments, the L1 is fundamentally impervious to moisture. The combination of the Sonaura™ capsule’s inherent properties, a specialized hydrophobic internal coating, and hydrostatic pressure-sealing via 0.4mm laser-drilled cap ports allows the microphone to remain functional even while completely submerged.
When used with the IP57-rated Lectrosonics DSSM micro-transmitter, the entire assembly becomes a waterproof powerhouse, providing total insurance against sweat-outs in theater settings and environmental hazards on reality TV sets.
The L1 maintains a discreet 5.4mm diameter footprint, compatible with standard industry mounting accessories. It features an ultra-flexible Kevlar-reinforced cable and a unique ID ring system at the connector for rapid on-set identification.
“The L1 is the culmination of the acoustic expertise of the Freedman Group, the cutting-edge manufacturing of Infineon, and Lectrosonics’ rich audio electronics heritage,” says Karl Winkler, EVP pf Product and Sales at Lectrosonics. “By leveraging MEMS technology, we’ve moved beyond the physical limitations of traditional microphones to give our users a tool that is more consistent, more robust, and quieter than anything previously possible. And wait until you hear the sound – it is incredible!”
The Lectrosonics L1 is available in Q2 in black with a LEMO connector, with white, brown, and beige colours and 5-pin connector variants following later in 2026. Expected MSRP ranges from $500 to $700 depending on kit and connector options.
Visit Lectrosonics at the NAB show in Las Vegas, NV, April 19-22, 2026, booth #C5307 in the Central Hall.
About Lectrosonics
Well-respected within the film, broadcast, and theatre technical communities since 1971, Lectrosonics wireless microphone systems and audio processing products are used daily in mission-critical applications by audio engineers familiar with the company’s dedication to quality, customer service, and innovation. Lectrosonics received an Academy Scientific and Technical Award for its Digital Hybrid Wireless® technology and is a US manufacturer based in Rio Rancho, New Mexico. Visit the company online at www.lectrosonics.com.
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